Light emitting diode packaging structure and method for manufacturing the same

ABSTRACT

The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

BACKGROUND Field of Invention

The present disclosure relates to a light emitting diode packagingstructure and a method for manufacturing the same.

Description of Related Art

Compared with the traditional illumination source, the light emittingdiode (LED) has the advantages of light weight, small volume, lowpollution and long life. It has been used as a new type of illuminationsource. In various fields, such as street lamps, traffic lights, signallights, spotlights and decorative lights. A typical light emitting diodepackaging structure includes a rigid printed circuit board, a lightemitting chip disposed on the rigid printed circuit board andelectrically connected to the circuits in the rigid printed circuitboard, and an encapsulate layer disposed on the rigid printed circuitboard and sealing the light emitting chip. In general, the typical lightemitting diode packaging structure has a greater thickness due to therigid printed circuit board and the circuits should be thick enough forproviding sufficient strength when forming the encapsulate layer.

In order to satisfy user demand for light, thin, short, and smallelectronic devices, the size of light emitting diode packages is gettingsmaller day by day. In view of the above, it is necessary to provide alight emitting diode package structure having a thinner thickness and amethod of manufacturing thereof.

SUMMARY

Accordingly, it is a primary object of the invention to provide a noveldisplay device and a method for manufacturing the same which may improvethe foregoing problems.

According to one aspect of the present disclosure, a light emittingdiode packaging structure is provided. The light emitting diodepackaging structure includes a flexible substrate, a first adhesivelayer, a micro light emitting element, a conductive pad, aredistribution layer, and an electrode pad. The first adhesive layer isdisposed on the flexible substrate. The micro light emitting element isdisposed on the first adhesive layer. The micro light emitting elementhas a first surface facing to the first adhesive layer and a secondsurface opposite to the first surface. The conductive pad is disposed onthe second surface of the micro light emitting element. Theredistribution layer covers the micro light emitting element and theconductive pad. The redistribution layer includes an insulating layerand a circuit layer embedded in the insulating layer, and the circuitlayer is electrically connected to the conductive pad. The electrode padis disposed on the redistribution layer and electrically connected tothe circuit layer. A total thickness of the flexible substrate, thefirst adhesive layer, the redistribution layer, and the electrode pad isless than 200 um.

In some embodiments of the present disclosure, a portion of the circuitlayer is in direct contact with the first adhesive layer.

In some embodiments of the present disclosure, the light emitting diodepackaging structure further includes a conductive via electricallyconnecting the electrode pad to the circuit layer.

In some embodiments of the present disclosure, the flexible substrateincludes polyimide, polyethylene terephthalate, poly(ethylenenaphthalate), polycarbonate, glass or a combination thereof.

In some embodiments of the present disclosure, a bottom surface of theflexible substrate is an even surface or an uneven surface.

In some embodiments of the present disclosure, the light emitting diodepackaging structure further includes a microstructure disposed on abottom surface of the flexible substrate.

In some embodiments of the present disclosure, the microstructureincludes an optical lens, an optical coating layer, or an optical film.

In some embodiments of the present disclosure, the light emitting diodepackaging structure further includes a carrier substrate disposed on abottom surface of the flexible substrate.

In some embodiments of the present disclosure, the carrier substrateincludes an alignment mark.

In some embodiments of the present disclosure, the light emitting diodepackaging structure further includes a second adhesive layer disposedbetween the carrier substrate and the flexible substrate.

According to another aspect of the present disclosure, a method formanufacturing a light emitting diode packaging structure is provided.The method includes the operations below. A flexible substrate (310)having a first surface and a second surface opposite thereof isprovided. A carrier substrate is formed on the first surface. Anadhesive layer is formed on the second surface. A micro light emittingelement is formed on the adhesive layer, wherein the micro lightemitting element has a conductive pad thereon opposite to the adhesivelayer. A redistribution layer is formed and covers the micro lightemitting element and the adhesive layer, wherein the redistributionlayer includes a circuit layer electrically connecting to the conductivepad and an insulating layer covering the circuit layer. An electrode padis formed on the redistribution layer and electrically connected to thecircuit layer, wherein a total thickness of the flexible substrate, theadhesive layer, the redistribution layer, and the electrode pad is lessthan 200 um.

In some embodiments of the present disclosure, the method furtherincludes the operations below. After forming the electrode pad, thecarrier substrate is removed. The flexible substrate is diced along ascribe line to form a plurality of light emitting diode packagingstructure.

In some embodiments of the present disclosure, the method furtherincludes the operations below. After removing the carrier substrate,texturing the first surface of the flexible substrate is textured or amicrostructure is formed on the first surface of the flexible substrate.

In some embodiments of the present disclosure, the microstructureincludes an optical lens, an optical coating layer, or an optical film.

In some embodiments of the present disclosure, the method furtherincludes the operations below. After removing the carrier substrate, thefirst surface of the flexible substrate is flatten.

In some embodiments of the present disclosure, the method furtherincludes the operations below. After forming the electrode pad, theflexible substrate is diced along a scribe line to form a plurality oflight emitting diode packaging structure.

In some embodiments of the present disclosure, the method furtherincludes the operations below. Before forming the electrode pad andafter forming the redistribution layer, a conductive via is formed inthe redistribution layer so that the conductive via electricallyconnects the electrode pad to the circuit layer.

In some embodiments of the present disclosure, the method furtherincludes the operations below. An alignment mark is formed on thecarrier substrate.

In some embodiments of the present disclosure, a portion of the circuitlayer is in direct contact with the adhesive layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the followingdetailed description of the embodiment, with reference made to theaccompanying drawings as follows:

FIG. 1 is a cross-sectional view illustrating a light emitting diodepackaging structure according to one comparative example of the presentdisclosure.

FIGS. 2A, 2B, 2C, and 2D are cross-sectional views illustrating a lightemitting diode packaging structure according to various embodiments ofthe present disclosure.

FIGS. 3, 4, 5, 6, 7, 8A, and 8B are cross-sectional views illustratingvarious process stages of manufacturing the light emitting diodepackaging structure according to various embodiments of the presentdisclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to the present embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings. Wherever possible, the same reference numbers are used in thedrawings and the description to refer to the same or like parts.Reference will now be made in detail to the present embodiments of thedisclosure, examples of which are illustrated in the accompanyingdrawings. Wherever possible, the same reference numbers are used in thedrawings and the description to refer to the same or like parts.

The terms “about” and “approximately” in the disclosure are used asequivalents. Any numerals used in this disclosure with or without“about,” “approximately,” etc. are meant to cover any normalfluctuations appreciated by one of ordinary skill in the relevant art.In certain embodiments, the term “approximately” or “about” refers to arange of values that fall within 20%, 10%, 5%, or less in eitherdirection (greater or less than) of the stated reference value unlessotherwise stated or otherwise evident from the context.

FIG. 1 is a cross-sectional view illustrating a light emitting diodepackaging structure 10 according to one comparative example of thepresent disclosure. Referring to FIG. 1, the light emitting diodepackaging structure 10 disclosed herein includes a rigid substrate 110,a light emitting element 130, and an encapsulation layer 190. To bespecific, the rigid substrate 110 is a rigid printed circuit board(PCB). The rigid substrate 110 may include epoxy molding compound (EMC).In addition, the rigid substrate 110 may further include metalliccircuits, such as, copper circuits, iron circuits, or other alloycircuit with good conductivity. For example, the rigid substrate 110 maybe a FR-4 substrate, BT substrate, or a molded interconnect substrate(MIS).

As shown in FIG. 1, the light emitting element 130 is disposed on therigid substrate 110 and electrically connected to the circuit layer inthe rigid substrate 110. The encapsulation layer 190 is disposed on therigid substrate 110 and covers the light emitting element 130. It wouldbe understood that a total thickness of the light emitting diodepackaging structure 10 using the rigid printed circuit board and knownmolding process is usually greater than 200 um.

FIG. 2A is a cross-sectional view illustrating a light emitting diodepackaging structure 20 a according to various embodiments of the presentdisclosure. The light emitting diode packaging structure 20 a includes aflexible substrate 210, a first adhesive layer 220, a micro lightemitting element 230, a conductive pad 240, a redistribution layer 250,and an electrode pad 260. To be specific, the flexible substrate 210 mayinclude transparent materials so as to meet the requirement of thetransparent display. In some embodiments of the present disclosure, theflexible substrate 210 may include polyimide, polyethyleneterephthalate, poly(ethylene naphthalate), polycarbonate, glass or acombination thereof. It can be understood that the flexible substrate210 is used to decrease an overall thickness of the light emitting diodepackaging structure 20 a and provides flexibility for the light emittingdiode packaging structure 20 a. It should be noted that the thickness ofthe flexible substrate 210 is less than 100 um. In some embodiments ofthe present disclosure, a bottom surface 211 of the flexible substrate210 may be an even surface or an uneven surface to increase the lightefficiency or modify the light profile. It can be understood that thebottom surface 211 of the flexible substrate 210 may be a light emittingsurface. In addition, another surface opposite to the bottom surface 211of the flexible substrate may also be a light emitting surface.

As shown in FIG. 2A, the first adhesive layer 220 is disposed on theflexible substrate 210. In some embodiments of the present disclosure,the first adhesive layer 220 may include insulating glue. For example,the material of the first adhesive layer 220 may be insulating glue suchas epoxy resin or silicone, but not limited thereto.

As shown in FIG. 2A, the micro light emitting element 230 is disposed onthe first adhesive layer 220. Specifically, the micro light emittingelement 230 has a first surface 231 facing to the first adhesive layer220 and a second surface 233 opposite to the first surface 231. Althougha number of he micro light emitting element 230 as shown in Fig.2A istwo, the number of he micro light emitting element 230 may be 3, 4, 5,6, or more according to demand. The micro light emitting element 230 mayemit red light, green light, blue light, or white light, but not limitedthereto.

As shown in FIG. 2A, the conductive pad 240 is disposed on the secondsurface 233 of the micro light emitting element 230. In some embodimentsof the present disclosure, the conductive pad 240 may include conductivematerials, such as copper, nickel, gold, aluminum, tungsten, iron, oralloys of above metals.

As shown in FIG. 2A, the redistribution layer 250 covers the micro lightemitting element 230 and the conductive pad 240. Specifically, theredistribution layer 250 includes an insulating layer 252 and a circuitlayer 254 embedded in the insulating layer 252, and the circuit layer254 is electrically connected to the conductive pad 240. It should benoted that the insulating layer 252 is transparent, so that the lightemitted from the micro light emitting element 230 can pass through theinsulating layer 252 to the outside of the light emitting diodepackaging structure 20 a. It can be understood that the insulating layer252 could also be used as a protective layer. Specifically, because theinsulating layer 252 covers the micro light emitting element 230 and thecircuit layer 254, the insulating layer 252 can block moisturepermeation and avoid oxidation of the circuit layer 254. Therefore, thelight emitting diode packaging structure 20 a of the present disclosureis not necessary to additionally include a protective layer. Althoughthe number of the redistribution layer 250 is one as shown in FIG. 2A,the number of the redistribution layer 250 can be two, three, or fouraccording to design requirements.

In some embodiments of the present disclosure, the insulating layer 252may include poly(methyl methacrylate) (PMMA), polyethylene terephthalate(PET), polystyrene (PS), polypropylene(PP), polyamide (PA),polycarbonate (PC), epoxy, silicon, and/or a combination thereof. Insome embodiments of the present disclosure, the circuit layer 254 mayinclude copper, nickel, gold, aluminum, tungsten, iron, or alloys ofabove metals. In some embodiments of the present disclosure, a portionof the circuit layer 254 is in direct contact with the first adhesivelayer 220 as shown in FIG. 2A.

As shown in FIG. 2A, the electrode pad 260 is disposed on theredistribution layer 250 and electrically connected to the circuit layer254. It is noted that a total thickness TK of the flexible substrate210, the first adhesive layer 220, the redistribution layer 250, and theelectrode pad 260 is less than 200 um. For example, the total thicknessTK of the flexible substrate 210, the first adhesive layer 220, theredistribution layer 250, and the electrode pad 260 may be about 100 um,110 um, 120 um, 130 um, 140 m, 150 um, 160 um, 170 um, 180 um, or 190um. In some embodiments of the present disclosure, the electrode pad 260may include copper, nickel, gold, aluminum, tungsten, iron, or alloys ofabove metals.

In some embodiments of the present disclosure, the light emitting diodepackaging structure 20 a further includes a conductive via 280electrically connecting the electrode pad 260 to the circuit layer 254.The material of the conductive via 280 may be the same as or similar tothe material of the electrode pad 260.

FIG. 2B is a cross-sectional view illustrating a light emitting diodepackaging structure 20 b according to various embodiments of the presentdisclosure. The light emitting diode packaging structure 20 b of FIG. 2Bis similar to that of FIG. 2A. The difference between the light emittingdiode packaging structure 20 b and the light emitting diode packagingstructure 20 a of the previous embodiment is that, in this embodiment,the light emitting diode packaging structure 20 b further includes amicrostructure 215 disposed on the bottom surface 211 of the flexiblesubstrate 210. In some embodiments of the present disclosure, themicrostructure 215 may include an optical lens, an optical coatinglayer, or an optical film. For example, the optical lens may includeresin, plastic, glass, or sapphire, but not limited thereto. The opticalcoating layer may include SiN_(x), SiO_(x), TiO₂, Al₂O₃, or MgF₂, butnot limited thereto. The optical film may be a linear polarizer, acircular polarizer, or a phase compensation plate, but not limitedthereto.

FIG. 2C is a cross-sectional view illustrating a light emitting diodepackaging structure 20 c according to various embodiments of the presentdisclosure. The light emitting diode packaging structure 20 c of FIG. 2Cis similar to that of FIG. 2A. The difference between the light emittingdiode packaging structure 20 c and the light emitting diode packagingstructure 20 a of the previous embodiment is that, in this embodiment,the bottom surface 211 of the flexible substrate 210 of the lightemitting diode packaging structure 20 c is an uneven surface.Specifically, the bottom surface 211 of the flexible substrate 210 ofthe light emitting diode packaging structure 20 b may have a roughnessby a surface roughening treatment.

FIG. 2D is a cross-sectional view illustrating a light emitting diodepackaging structure 20 d according to various embodiments of the presentdisclosure. The light emitting diode packaging structure 20 d of FIG. 2Dis similar to that of FIG. 2A. The difference between the light emittingdiode packaging structure 20 d and the light emitting diode packagingstructure 20 a of the previous embodiment is that, in this embodiment,the light emitting diode packaging structure 20 d further includes acarrier substrate 270 and a second adhesive layer 290. To be specific,the carrier substrate 270 is disposed on the bottom surface 211 of theflexible substrate 210. The second adhesive layer 290 is disposedbetween the carrier substrate 270 and the flexible substrate 210 toincrease the bonding force between the carrier substrate 270 and theflexible substrate 210. The material of the second adhesive layer 290may be the same as or similar to the material of the first adhesivelayer 220. In some embodiments of the present disclosure, the carriersubstrate 270 may include an alignment mark (not shown) thereon. In someembodiments of the present disclosure, the carrier substrate 270 may betransparent, translucent, or opaque. In some embodiments of the presentdisclosure, the carrier substrate 270 may include organic materials,inorganic materials, or metallic materials, but not limited thereto.

A method for manufacturing a light emitting diode packaging structure 20a and 20 d is also provided herein. FIGS. 3, 4, 5, 6, 7, 8A, and 8B arecross-sectional views illustrating various process stages ofmanufacturing the light emitting diode packaging structure 20 a and 20 daccording to various embodiments of the present disclosure.

Referring to FIG. 3, a flexible substrate 310 is provided. To bespecific, the flexible substrate 310 has a first surface 311 and asecond surface 313 opposite thereof. It should be noted that thematerial and other features of the flexible substrate 310 may be thesame as or similar to that of the flexible substrate 210 shown in FIG.2A, and the description thereof is omitted.

As shown in FIG. 3, a carrier substrate 320 is formed on the firstsurface 311 of the flexible substrate 310. To be specific, the carriersubstrate 320 is formed on the first surface 311 of the flexiblesubstrate 310 by an adhesive layer 390. It can be understood that theadhesive layer 390 can increase the bonding force between the carriersubstrate 320 and the flexible substrate 310. It should be noted thatthe material and other features of the carrier substrate 320 and theadhesive layer 390 may be the same as or similar to that of the carriersubstrate 270 and the second adhesive layer 290 shown in FIG. 2D, andthe description thereof is omitted. The carrier substrate 320 canprovide support for various stages of a manufacturing the light emittingdiode packaging structure 20 a and 20 d. In some embodiments of thepresent disclosure, an alignment mark (not shown) may be formed on thecarrier substrate 320 to provide an alignment mark for various stages ofa manufacturing the light emitting diode packaging structure 20 a and 20d.

Referring to FIG. 4, an adhesive layer 330 is formed on the secondsurface 313 of the flexible substrate 310. In some embodiments of thepresent disclosure, the adhesive layer 330 fully covers the secondsurface 313 of the flexible substrate 310. It should be noted that thematerial and other features of the adhesive layer 330 may be the same asor similar to that of the first adhesive layer 220 shown in FIG. 2A, andthe description thereof is omitted.

Referring to FIG. 4, a micro light emitting element 340 is formed on theadhesive layer 330. To be specific, the micro light emitting element 340has a conductive pad 342 thereon opposite to the adhesive layer 330. Itshould be noted that the material and other features of the micro lightemitting element 340 and the conductive pad 342 may be the same as orsimilar to that of the micro light emitting element 230 and theconductive pad 240 shown in FIG. 2A, and the description thereof isomitted.

Referring to FIG. 5, a redistribution layer 350 covers the micro lightemitting element 340 and the adhesive layer 330. To be specific, theredistribution layer 350 includes a circuit layer 352 electricallyconnecting to the conductive pad 342 and an insulating layer 354covering the circuit layer 352. In some embodiments of the presentdisclosure, a portion of the circuit layer 352 is in direct contact withthe adhesive layer 330. In some embodiments of the present disclosure,the redistribution layer 350 could be formed by the redistribution layer(RDL) technical to achieve the effect of thin line width. It should benoted that the material and other features of the circuit layer 352 andthe insulating layer 354 may be the same as or similar to that of thecircuit layer 254 and the insulating layer 252 shown in FIG. 2A, and thedescription thereof is omitted.

Referring to FIGS. 6-7, an electrode pad 360 is formed on theredistribution layer 350 and electrically connected to the circuit layer352. In some embodiments of the present disclosure, before forming theelectrode pad 360 and after forming the redistribution layer 350, themethod further includes forming a conductive via 710 in theredistribution layer 350 so that the conductive via 710 electricallyconnects the electrode pad 360 to the circuit layer 352. For example, athrough hole 610 may be first formed to penetrate the insulating layer354 and therefore a portion of the circuit layer 352 is exposed from thethrough hole 610. For example, the through hole 610 could be formed bylithography process, drilling process, laser drilling process, or othersuitable processes. Next, a conductive material is filled up the throughhole 610 to form the conductive via 710. The electrode pad 360 thencovers the conductive via 710. It can be understood that the conductivevia 710 and the electrode pad 360 can be formed separately orsimultaneously. It is noted that a total thickness TK of the flexiblesubstrate 310, the adhesive layer 330, the redistribution layer 350, andthe electrode pad 360 is less than 200 um. For example, the totalthickness TK of the flexible substrate 310, the adhesive layer 330, theredistribution layer 350, and the electrode pad 360 may be about 100 um,110 um, 120 um, 130 um, 140 um, 150 um, 160 um, 170 um, 180 um, or 190um.

Next, referring to FIG. 8A, after forming the electrode pad 360, themethod further includes removing the carrier substrate 320 and dicingthe flexible substrate 310 along a scribe line SL to form a plurality oflight emitting diode packaging structure 20 a. In some embodiments ofthe present disclosure, after removing the carrier substrate 320, themethod further includes texturing the first surface 311 of the flexiblesubstrate 310 or forming a microstructure (not shown) on the firstsurface 311 of the flexible substrate. For example, the microstructureis the same as or similar to the microstructure 215 shown in FIG. 2B,such as an optical lens, an optical coating layer, or an optical film.In some embodiments of the present disclosure, after removing thecarrier substrate 320, the method further includes flattening the firstsurface 311 of the flexible substrate 310.

Alternatively, referring to FIG. 8B, after forming the electrode pad360, the method further includes dicing the flexible substrate 310 alonga scribe line SL to form a plurality of light emitting diode packagingstructure 20 d. It is noted that the carrier substrate 320 may not beremoved.

From the embodiments described above of the present disclosure, thelight emitting diode packaging structure and the method formanufacturing thereof can decrease the overall thickness to less than200 um. More specifically, the light emitting diode packaging structureof the present disclosure uses the flexible substrate to replace thecore layer of the rigid substrate of traditional light emitting diodepackaging structure, so that the overall thickness of the light emittingdiode packaging structure can be reduced and flexible productrequirements can be met. Moreover, the present disclosure also usesredistribution layer technology to reduce the thickness of the rigidsubstrate multilayer process.

Although the present disclosure has been described in considerabledetail with reference to certain embodiments thereof, other embodimentsare possible. Therefore, the spirit and scope of the appended claimsshould not be limited to the description of the embodiments containedherein.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentdisclosure without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present disclosurecover modifications and variations of this invention provided they fallwithin the scope of the following claims.

1. A light emitting diode packaging structure, comprising: a flexiblesubstrate; a first adhesive layer disposed on the flexible substrate; amicro light emitting element disposed on the first adhesive layer,wherein the micro light emitting element has a first surface facing tothe first adhesive layer and a second surface opposite to the firstsurface; a conductive pad disposed on the second surface of the microlight emitting element; a redistribution layer covering the micro lightemitting element and the conductive pad, wherein the redistributionlayer comprises an insulating layer and a circuit layer embedded in theinsulating layer, and the circuit layer is electrically connected to theconductive pad; and an electrode pad disposed on the redistributionlayer and electrically connecting to the circuit layer, wherein a totalthickness of the flexible substrate, the first adhesive layer, theredistribution layer, and the electrode pad is less than 200 um.
 2. Thelight emitting diode packaging structure of claim 1, wherein a portionof the circuit layer is in direct contact with the first adhesive layer.3. The light emitting diode packaging structure of claim 1, furthercomprising a conductive via electrically connecting the electrode pad tothe circuit layer.
 4. The light emitting diode packaging structure ofclaim 1, wherein the flexible substrate comprises polyimide,polyethylene terephthalate, poly(ethylene naphthalate), polycarbonate,glass or a combination thereof.
 5. The light emitting diode packagingstructure of claim 1, wherein a bottom surface of the flexible substrateis an even surface or an uneven surface.
 6. The light emitting diodepackaging structure of claim 1, further comprising a microstructuredisposed on a bottom surface of the flexible substrate.
 7. The lightemitting diode packaging structure of claim 6, wherein themicrostructure comprises an optical lens, an optical coating layer, oran optical film.
 8. The light emitting diode packaging structure ofclaim 1, further comprising a carrier substrate disposed on a bottomsurface of the flexible substrate.
 9. The light emitting diode packagingstructure of claim 8, wherein the carrier substrate comprises analignment mark.
 10. The light emitting diode packaging structure ofclaim 8, further comprising a second adhesive layer disposed between thecarrier substrate and the flexible substrate. 11-20. (canceled)